Kyoung-Lim Suk

Low Cost Si-Less RDL Interposer Package for High Performance Computing Applications

Kyoung-Lim Suk, Seok Hyun Lee, Jong‐Youn Kim et al. · 2018 · 66 citations

Engineering, Vlsi Design, Computer Architecture +21

Nanofiber anisotropic conductive adhesives (ACAs) for ultra fine pitch chip-on-film (COF) packaging

Kyoung-Lim Suk, Chang-Kyu Chung, Kyung‐Wook Paik · 2011 · 24 citations

Materials Science, Electroactive Material, Nanofiber +15

Advanced RDL Interposer PKG Technology for Heterogeneous Integration

Jae-gwon Jang, Kyoung-Lim Suk, Seokhyun Lee et al. · 2020 · 16 citations

Artificial Intelligence, Engineering, Vlsi Design +16

Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs)

Kyoung-Lim Suk, Kyosung Choo, Sung Jin Kim et al. · Microelectronics Reliability · 2012 · 13 citations

Materials Science, Two-metal Layer Fpcs, Chip-scale Package +10

Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)

Kyoung-Lim Suk, Hwa–Young Son, Chang-Kyu Chung et al. · Microelectronics Reliability · 2011 · 12 citations

Materials Science, Electrical Engineering, Anisotropic Conductive Films +12