Concepedia

Author

Kyoung-Lim Suk

Korea Advanced Institute of Science and Technology

Also Known As

Kyoung-Lim Suk, Kyoung-lim Suk, Kyounglim Suk

22

Publications

162

Citations

6

H-Index

25

Concepts

All Affiliations

Korea Advanced Institute of Science and TechnologyHanwha Techwin (South Korea)Samsung (South Korea)
KS

About

Kyoung-Lim Suk is an author at Korea Advanced Institute of Science and Technology specializing in engineering, electronic packaging, and microelectronics.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

6

6

142

2

Electrical Engineering

4

4

105

3

Applied Physics

2

2

37

4

Computer Engineering

2

2

82

5

Materials Engineering

1

1

11

Kyoung-Lim Suk

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6

Publications

142

Citations

6

H-Index

YearCitations

Low Cost Si-Less RDL Interposer Package for High Performance Computing Applications

Kyoung-Lim Suk, Seok Hyun Lee, Jong‐Youn Kim,

2018

66

Nanofiber anisotropic conductive adhesives (ACAs) for ultra fine pitch chip-on-film (COF) packaging

Kyoung-Lim Suk, Chang-Kyu Chung, Kyung‐Wook Paik

2011

24

Advanced RDL Interposer PKG Technology for Heterogeneous Integration

Jae-gwon Jang, Kyoung-Lim Suk, Seokhyun Lee,

2020

16

Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs)

Kyoung-Lim Suk, Kyosung Choo, Sung Jin Kim,

Microelectronics Reliability

2012

13

Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)

Kyoung-Lim Suk, Hwa–Young Son, Chang-Kyu Chung,

Microelectronics Reliability

2011

12

Embedded chip-in-flex (CIF) packages using wafer level package (WLP) with pre-applied anisotropic conductive films (ACFs)

Kyoung-Lim Suk, Hwa–Young Son, Chang-Kyu Chung,

2009

11

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