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Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)

Materials ScienceElectrical EngineeringAnisotropic Conductive FilmsEngineeringChip-scale PackageFlexible ElectronicsMicrofabricationAdvanced Packaging (Semiconductors)Wafer Scale ProcessingChip On BoardChip AttachmentWafer Level PackageElectronic PackagingFlexible Chip-on-flexMicroelectronics