Concepedia

Seok Hyun Lee

SH

Statistics

Publications

2

Citations

89

H-Index

2

Active since

2018

Affiliations

Samsung (South Korea)(Current)

Seok Hyun Lee is an author at Samsung (South Korea) specializing in electronic packaging, advanced packaging, and computer engineering.

Top concepts

EngineeringMicroelectronicsAdvanced PackagingIntegrated CircuitsComputer EngineeringElectronic PackagingComputer ArchitectureElectrical EngineeringVlsiVlsi Design

Publications per year

2018–2021

2

Publications

2

Low Cost Si-Less RDL Interposer Package for High Performance Computing Applications

Kyoung-Lim Suk, Seok Hyun Lee, Jong‐Youn Kim et al. · 2018 · 66 citations

Engineering, Vlsi Design, Computer Architecture +21

Novel 2.5D RDL Interposer Packaging: A Key Enabler for the New Era of Heterogenous Chip Integration

Min Jung Kim, Seok Hyun Lee, Kyoung Lim Suk et al. · 2021 · 23 citations

Novel 2.5D, Engineering, Computer Architecture +20

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