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Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs)

Materials ScienceTwo-metal Layer FpcsChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Flexible ElectronicsMicrofabricationChip On BoardApplied PhysicsPrinted ElectronicsChip AttachmentElectronic PackagingMicroelectronics