Nanofiber anisotropic conductive adhesives (ACAs) for ultra fine pitch chip-on-film (COF) packaging

Abstract

Nanofiber ACFs composed of adhesive resins, conductive particles, and nanofibers were demonstrated for ultra fine pitch COF packages. PAN nanofibers and PAN nanofiber containing conductive particles inside the fibers were successfully produced using electrospinning methods. The effects of nanofiber thickness and structure on electrical properties of nanofiber ACFs were investigated.