I. Charles Ume - Concepedia

Author

I. Charles Ume

Georgia Institute of Technology

Also Known As

I Charles Ume, I. C. Ume, I. Charles Ume, I.C. Ume, I.Charles Ume, Ifeanyi C. Ume, Ifeanyi Charles Ume

126

Publications

1.4K

Citations

H-Index

Concepts

All Affiliations

Georgia Institute of Technology

About

I. Charles Ume is an author at Georgia Institute of Technology specializing in engineering, mechanical engineering, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	19	48	1.1K
2	Education	8	8	300
3	Applied Physics	6	6	177
4	Natural Sciences	2	2	29
5	Biomedical Engineering	2	2	43

I. Charles Ume

Publications

1.2K

Citations

H-Index

Page 1

	Year	Citations
Warpage measurement comparison using shadow Moire and projection Moire methods Hai Ding, Reinhard E. Powell, C.R. Hanna, IEEE Transactions on Components and Packaging Technologies Optical MaterialsEngineeringMicroscopyMeasurementOptical Testing	2002	101
Development of automated real-time data acquisition system for robotic weld quality monitoring Matthew J. Miller, Bao Mi, Akio Kita, Mechatronics Condition MonitoringReal-time MonitoringEngineeringMeasurementIndustrial Engineering	2002	54
A novel approach for flip chip solder joint quality inspection: laser ultrasound and interferometric system Sheng Liu, Dathan S. Erdahl, I. Charles Ume, IEEE Transactions on Components and Packaging Technologies Flip ChipInterferometric SystemChip-scale PackageEngineeringChip On Board	2001	52
Automated system for laser ultrasonic sensing of weld penetration George Graham, I. Charles Ume Mechatronics EngineeringWelding ProcessMechanical EngineeringStructural Health MonitoringLaser Ultrasonic Sensing	1997	50
System for Real-Time Measurement of Thermally Induced PWB/PWA Warpage M.R. Stiteler, I. Charles Ume Journal of Electronic Packaging Infrared Soldering ProcessesEngineeringMeasurementCalibrationReal-time Measurement	1997	39
Finite element analysis of PWB warpage due to the solder masking process I. Charles Ume, T. Martin, J.T. Gatro IEEE Transactions on Components Packaging and Manufacturing Technology Part A Industrial DesignElectrical EngineeringSolder Masking ProcessEngineeringChip On Board	1997	37
A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects Chia-Yu Fu, David L. McDowell, I. Charles Ume Journal of Electronic Packaging EngineeringMechanical EngineeringFinite Element ProcedureNumerical SimulationThermal Modeling	1998	34
Vibration Analysis Based Modeling and Defect Recognition for Flip-Chip Solder-Joint Inspection Sheng Liu, I. Charles Ume Journal of Electronic Packaging Fault DiagnosisEngineeringMechanical EngineeringDefect RecognitionVibration Analysis	2002	33
Laser generated ultrasound by material ablation using fiber optic delivery Sandra Nowland Hopko, I. Charles Ume Ultrasonics Medical UltrasoundEngineeringFiber Optic DeliveryPower UltrasoundLaser Ablation	1999	32
Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System Sheng Liu, I. Charles Ume Journal of Electronic Packaging Condition MonitoringEngineeringSignal Processing MethodsMeasurementChip On Board	2003	31

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