Concepedia

I. Charles Ume

IC

52

Publications

1.2K

Citations

20

H-Index

1996

Active since

Affiliations

Georgia Institute of Technology(Current)

I. Charles Ume is an author at Georgia Institute of Technology specializing in engineering, mechanical engineering, and electronic packaging.

Top concepts

EngineeringMechanical EngineeringElectronic PackagingInstrumentationStructural Health MonitoringMicroelectronicsMaterial ScienceUltrasoundComputer EngineeringElectrical Engineering

Publications per year

1996–2021

52

Publications

52

Warpage measurement comparison using shadow Moire and projection Moire methods

Hai Ding, Reinhard E. Powell, C.R. Hanna et al. · IEEE Transactions on Components and Packaging Technologies · 2002 · 101 citations

Optical Materials, Engineering, Microscopy +29

Development of automated real-time data acquisition system for robotic weld quality monitoring

Matthew J. Miller, Bao Mi, Akio Kita et al. · Mechatronics · 2002 · 54 citations

Condition Monitoring, Real-time Monitoring, Engineering +13

A novel approach for flip chip solder joint quality inspection: laser ultrasound and interferometric system

Sheng Liu, Dathan S. Erdahl, I. Charles Ume et al. · IEEE Transactions on Components and Packaging Technologies · 2001 · 52 citations

Flip Chip, Interferometric System, Chip-scale Package +15

Automated system for laser ultrasonic sensing of weld penetration

George Graham, I. Charles Ume · Mechatronics · 1997 · 50 citations

Engineering, Welding Process, Mechanical Engineering +6

System for Real-Time Measurement of Thermally Induced PWB/PWA Warpage

M.R. Stiteler, I. Charles Ume · Journal of Electronic Packaging · 1997 · 39 citations

Infrared Soldering Processes, Engineering, Measurement +15

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