Suresh K. Sitaraman

Magnetic Alignment of Hexagonal Boron Nitride Platelets in Polymer Matrix: Toward High Performance Anisotropic Polymer Composites for Electronic Encapsulation

Ziyin Lin, Yan Liu, Sathyanarayanan Raghavan et al. · ACS Applied Materials & Interfaces · 2013 · 466 citations

Natural Sciences, Materials Engineering, Materials Science +12

Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)

Xi Liu, Qiao Chen, Pradeep Dixit et al. · 2009 · 172 citations

Engineering, Electrical Engineering, Materials Engineering +17

Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test

Xi Liu, Qiao Chen, Venkatesh Sundaram et al. · Microelectronics Reliability · 2012 · 82 citations

Engineering, Materials Engineering, Materials Science +15

Elastic–plastic characterization of thin films using nanoindentation technique

Zhaohui Shan, Suresh K. Sitaraman · Thin Solid Films · 2003 · 78 citations

Natural Sciences, Materials Engineering, Materials Science +16

Die cracking and reliable die design for flip-chip assemblies

S. Michaelides, Suresh K. Sitaraman · IEEE Transactions on Advanced Packaging · 1999 · 76 citations

Engineering, Materials Engineering, Materials Science +17