Venkatesh Sundaram

Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test

Xi Liu, Qiao Chen, Venkatesh Sundaram et al. · Microelectronics Reliability · 2012 · 82 citations

Engineering, Materials Engineering, Materials Science +15

First Demonstration of Compact, Ultra-Thin Low-Pass and Bandpass Filters for 5G Small-Cell Applications

Muhammad Ali, Fuhan Liu, Atom O. Watanabe et al. · IEEE Microwave and Wireless Components Letters · 2018 · 76 citations

Engineering, Electrical Engineering, Microelectronics +16

Prevention of Cracking From RDL Stress and Dicing Defects in Glass Substrates

Scott McCann, Yoichiro Sato, Venkatesh Sundaram et al. · IEEE Transactions on Device and Materials Reliability · 2015 · 37 citations

Engineering, Materials Engineering, Materials Science +9

Miniaturized High-Performance Filters for 5G Small-Cell Applications

Muhammad Ali, Fuhan Liu, Atom O. Watanabe et al. · 2018 · 34 citations

Engineering, Electrical Engineering, Materials Science +17

Study of cracking of thin glass interposers intended for microelectronic packaging substrates

Scott McCann, Yoichiro Sato, Venkatesh Sundaram et al. · 2015 · 29 citations

Natural Sciences, Materials Engineering, Materials Science +17