L.J. Ernst

Interfacial Delamination Mechanisms During Soldering Reflow With Moisture Preconditioning

Xuejun Fan, G.Q. Zhang, W.D. van Driel et al. · IEEE Transactions on Components and Packaging Technologies · 2008 · 106 citations

Moisture Diffusion, Engineering, Flip Chip Packages +17

Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound

M. Sadeghinia, K.M.B. Jansen, L.J. Ernst · International Journal of Adhesion and Adhesives · 2011 · 75 citations

Materials Science, Engineering, Polymer Science +6

A Micromechanics-Based Vapor Pressure Model in Electronic Packages

Xuejun Fan, Jiang Zhou, G. Q. Zhang et al. · Journal of Electronic Packaging · 2004 · 70 citations

Engineering, Micromechanics, Initial Vapor Pressure +23

Effect of temperature and humidity on moisture diffusion in an epoxy moulding compound material

K.M.B. Jansen, M.F. Zhang, L.J. Ernst et al. · Microelectronics Reliability · 2020 · 58 citations · Full text

Moisture Diffusion, Engineering, Mechanical Engineering +17

Prediction and verification of process induced warpage of electronic packages

W.D. van Driel, G. Q. Zhang, J.H.J. Janssen et al. · Microelectronics Reliability · 2003 · 56 citations

Industrial Design, Chip-scale Package, Engineering +10