L.J. Ernst - Concepedia

Author

L.J. Ernst

Also Known As

Ernst, L. J., Ernst, L.J., Jansen, Kaspar M B, Kaspar Jansen, Kaspar M. B. Jansen, L. -J. Ernst, L. Ernst, L. J. Ernst, L.J Ernst, L.J. ERNST

239

Publications

2.8K

Citations

H-Index

Concepts

All Affiliations

Delft University of Technology Philips (Netherlands)Infineon Technologies (Germany)NXP (Netherlands)Philips (United States)

About

L.J. Ernst is an author at Delft University of Technology specializing in engineering, mechanical engineering, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	28	91	2.3K
2	Applied Physics	13	19	379
3	Social Sciences	2	2	21
4	Civil Engineering	2	2	70
5	Chemistry	1	1	31

L.J. Ernst

Publications

2.4K

Citations

H-Index

Page 1

	Year	Citations
Interfacial Delamination Mechanisms During Soldering Reflow With Moisture Preconditioning Xuejun Fan, G.Q. Zhang, W.D. van Driel, IEEE Transactions on Components and Packaging Technologies Moisture DiffusionEngineeringFlip Chip PackagesRefrigerationDesiccation	2008	106
Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound M. Sadeghinia, K.M.B. Jansen, L.J. Ernst International Journal of Adhesion and Adhesives Materials ScienceEngineeringPolymer ScienceMechanical EngineeringEpoxy Molding Compound	2011	75
A Micromechanics-Based Vapor Pressure Model in Electronic Packages Xuejun Fan, Jiang Zhou, G. Q. Zhang, Journal of Electronic Packaging EngineeringMicromechanicsInitial Vapor PressureMechanical EngineeringVapor Pressure	2004	70
Effect of temperature and humidity on moisture diffusion in an epoxy moulding compound material K.M.B. Jansen, M.F. Zhang, L.J. Ernst, Microelectronics Reliability Moisture DiffusionEngineeringMechanical EngineeringThermoplastic CompositeSoft Matter	2020	58
Prediction and verification of process induced warpage of electronic packages W.D. van Driel, G. Q. Zhang, J.H.J. Janssen, Microelectronics Reliability Industrial DesignChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Hardware Reliability	2003	56
Driving Mechanisms of Delamination Related Reliability Problems in Exposed Pad Packages W.D. van Driel, M.A.J. van Gils, Xuejun Fan, IEEE Transactions on Components and Packaging Technologies Pad PackagesEngineeringMechanical EngineeringMechanics ModelingDamage Mechanism	2008	54
Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound W.D. van Driel, J.H.J. Janssen, G. Q. Zhang, Journal of Electronic Packaging EngineeringMechanical EngineeringMolding (Process)Mechanics ModelingAnisotropic Behavior	2003	52
Characterization of the viscoelastic properties of an epoxy molding compound during cure M. Sadeghinia, K.M.B. Jansen, L.J. Ernst Microelectronics Reliability Materials ScienceEngineeringPolymer ScienceMechanical EngineeringRheological Property	2012	52
Application of the network alteration theory for modeling the time-dependent constitutive behaviour of rubbers. E.G. Septanika, L.J. Ernst Mechanics of Materials EngineeringDynamic Constitutive BehaviorMechanical BehaviorMechanicsElasticity (Physics)	1998	49
Response Surface Modeling for Nonlinear Packaging Stresses W.D. van Driel, G. Q. Zhang, J.H.J. Janssen, Journal of Electronic Packaging EngineeringMechanical EngineeringNonlinear Packaging StressesResidual StressStructural Optimization	2003	48

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