Prediction and verification of process induced warpage of electronic packages - Concepedia

Concepedia

Publication | Closed Access

Prediction and verification of process induced warpage of electronic packages

56

Citations

2

References

2003

Year

W.D. van Driel, G. Q. Zhang, J.H.J. Janssen, L.J. Ernst, Fei Su, K. S. Chian, Shujuan Yi

Microelectronics Reliability

Industrial DesignChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Hardware ReliabilityIndustrial EngineeringChip On BoardComputer EngineeringSystems EngineeringProcess Induced WarpageElectronic PackagingMechanics Of MaterialsPhysic Of Failure

References

	Year	Citations

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