J.H.J. Janssen - Concepedia

Author

J.H.J. Janssen

Also Known As

Baltissen, Marijke, J. H. J. Janssen, J. Janssen, J.H.J. Janssen, Joris H Janssen, Joris H. Janssen, Joris Janssen, Joris van Arensbergen, Joris van Arensbergen, Lauric, S

Publications

Citations

H-Index

Concepts

All Affiliations

Philips (Netherlands)Delft University of Technology NXP (Netherlands)Philips (United States)Applied Technologies (United States)

About

J.H.J. Janssen is an author at Philips (Netherlands) specializing in engineering, mechanics of materials, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	21	29	871
2	Applied Physics	4	4	94
3	Medicine	1	1	20
4	Natural Sciences	1	1	22
5	Civil Engineering	1	1	16

J.H.J. Janssen

Publications

Citations

H-Index

Page 1

	Year	Citations
Thermal-Aware Synthesis of 5G Base Station Antenna Arrays: An Overview and a Sparsity-Based Approach Yanki Aslan, Jan Puskely, J.H.J. Janssen, IEEE Access Heat Removal CapabilitiesElectrical EngineeringThermal-aware SynthesisEngineeringPlanar Aesas	2018	98
Effect of brushing force and time on plaque removal using a powered toothbrush Giles McCracken, J.H.J. Janssen, Matthew Swan, Journal Of Clinical Periodontology	2003	76
Prediction and verification of process induced warpage of electronic packages W.D. van Driel, G. Q. Zhang, J.H.J. Janssen, Microelectronics Reliability Industrial DesignChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Hardware Reliability	2003	56
Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound W.D. van Driel, J.H.J. Janssen, G. Q. Zhang, Journal of Electronic Packaging EngineeringMechanical EngineeringMolding (Process)Mechanics ModelingAnisotropic Behavior	2003	52
Response Surface Modeling for Nonlinear Packaging Stresses W.D. van Driel, G. Q. Zhang, J.H.J. Janssen, Journal of Electronic Packaging EngineeringMechanical EngineeringNonlinear Packaging StressesResidual StressStructural Optimization	2003	48
Numerical modeling of warpage induced in QFN array molding process Daoguo Yang, K.M.B. Jansen, L.J. Ernst, Microelectronics Reliability EngineeringMechanical EngineeringApplied PhysicsSolid MechanicsComputational Mechanics	2007	46
Mechanical Modeling and Characterization of the Curing Process of Underfill Materials L.J. Ernst, C. van ‘t Hof, Daoguo Yang, Journal of Electronic Packaging EngineeringMechanical EngineeringResidual StressThermoplastic CompositeThermo-setting Polymers	2002	43
Analysis of Cu/low-k bond pad delamination by using a novel failure index M.A.J. van Gils, O. van der Sluis, G.Q. Zhang, Microelectronics Reliability Materials ScienceMaterials EngineeringElectrical EngineeringEngineeringDurability Performance	2006	43
Why matrix reduction is better than objective function based optimization in compact thermal model creation J.H.J. Janssen, Lorenzo Codecasa Numerical AnalysisLarge-scale Global OptimizationReduced Order ModelingEngineeringEnergy Efficiency	2015	39
Virtual qualification of moisture induced failures of advanced packages M.A.J. van Gils, W.D. van Driel, G.Q. Zhang, Microelectronics Reliability ReliabilityReliability EngineeringEngineeringVirtual QualificationIndustrial Engineering	2007	37

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