G. Q. Zhang - Concepedia

Author

G. Q. Zhang

Delft University of Technology

Also Known As

G. Q. Zhang, G.Q. Zhang, Goukai Zhang, Guangxue Zhang, Guoyang Zhang, Zhang, Guo-Qiang

Publications

1.1K

Citations

H-Index

Concepts

All Affiliations

Delft University of Technology Philips (Netherlands)Lamar University Chinese Academy of Sciences Institute of Semiconductors

About

G. Q. Zhang is an author at Delft University of Technology specializing in engineering, mechanical engineering, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	16	23	759
2	Applied Physics	8	8	217
3	Business	1	1	19
4	Chemical Engineering	1	1	43
5	Civil Engineering	1	1	19

G. Q. Zhang

Publications

804

Citations

H-Index

Page 1

	Year	Citations
A Micromechanics-Based Vapor Pressure Model in Electronic Packages Xuejun Fan, Jiang Zhou, G. Q. Zhang, Journal of Electronic Packaging EngineeringMicromechanicsInitial Vapor PressureMechanical EngineeringVapor Pressure	2004	70
Degradation Mechanisms of Mid-Power White-Light LEDs Under High-Temperature–Humidity Conditions Jianlin Huang, D. S. Golubović, Sau Koh, IEEE Transactions on Device and Materials Reliability White OledElectrical EngineeringSolid-state LightingEngineeringLight Regulation	2015	62
Rapid Degradation of Mid-Power White-Light LEDs in Saturated Moisture Conditions Jianlin Huang, D. S. Golubović, Sau Koh, IEEE Transactions on Device and Materials Reliability Materials ScienceWhite OledElectrical EngineeringOptical MaterialsEngineering	2015	58
Prediction and verification of process induced warpage of electronic packages W.D. van Driel, G. Q. Zhang, J.H.J. Janssen, Microelectronics Reliability Industrial DesignChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Hardware Reliability	2003	56
Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound W.D. van Driel, J.H.J. Janssen, G. Q. Zhang, Journal of Electronic Packaging EngineeringMechanical EngineeringMolding (Process)Mechanics ModelingAnisotropic Behavior	2003	52
Response Surface Modeling for Nonlinear Packaging Stresses W.D. van Driel, G. Q. Zhang, J.H.J. Janssen, Journal of Electronic Packaging EngineeringMechanical EngineeringNonlinear Packaging StressesResidual StressStructural Optimization	2003	48
Numerical modeling of warpage induced in QFN array molding process Daoguo Yang, K.M.B. Jansen, L.J. Ernst, Microelectronics Reliability EngineeringMechanical EngineeringApplied PhysicsSolid MechanicsComputational Mechanics	2007	46
Product level accelerated lifetime test for indoor LED luminaires Sau Koh, Cadmus Yuan, Bo Sun,	2013	45
Mechanical Modeling and Characterization of the Curing Process of Underfill Materials L.J. Ernst, C. van ‘t Hof, Daoguo Yang, Journal of Electronic Packaging EngineeringMechanical EngineeringResidual StressThermoplastic CompositeThermo-setting Polymers	2002	43
Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products M. Yazdan Mehr, W.D. van Driel, K.M.B. Jansen, Microelectronics Reliability Materials ScienceChemical EngineeringEngineeringPlastic LensOptical Properties	2013	43

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