Jiang Zhou

Advanced Numerical and Experimental Techniques for Analysis of Dynamic Responses and Solder Joint Reliability During Drop Impact

Jing En Luan, Tong Yan Tee, E. Pek et al. · IEEE Transactions on Components and Packaging Technologies · 2006 · 79 citations

Engineering, Impact (Mechanics), Structural Crashworthiness +20

A Micromechanics-Based Vapor Pressure Model in Electronic Packages

Xuejun Fan, Jiang Zhou, G. Q. Zhang et al. · Journal of Electronic Packaging · 2004 · 70 citations

Engineering, Micromechanics, Initial Vapor Pressure +23

Package structural integrity analysis considering moisture

Xuejun Fan, Jiang Zhou, Abhijit Chandra · 2008 · 39 citations

Popcorn Failure, Engineering, Flip Chip Package +18

Multi-physics modeling in virtual prototyping of electronic packages––combined thermal, thermo-mechanical and vapor pressure modeling

Xuejun Fan, Jiang Zhou, G.Q. Zhang · Microelectronics Reliability · 2004 · 37 citations

Engineering, Virtual Engineering, Mechanical Engineering +15

Investigation of non-uniform moisture distribution on determination of hygroscopic swelling coefficient and finite element modeling for a flip chip package

Jiang Zhou, S.P. Lahoti, Muskan Sitlani et al. · 2005 · 36 citations

Engineering, Flip Chip Package, Mechanical Engineering +17