Multi-physics modeling in virtual prototyping of electronic packages––combined thermal, thermo-mechanical and vapor pressure modeling

Moisture absorption and desorption predictions for plastic ball grid array packages

Jesse Galloway, B.M. Miles · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1997 · 188 citations

Engineering, Mechanical Engineering, Experimental Weight Gain +17

Behavior of delaminated plastic IC packages subjected to encapsulation cooling, moisture absorption, and wave soldering

Sheng Liu, Yuhai Mei · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1995 · 115 citations

Engineering, Food Packaging, Mechanical Engineering +22

Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading

Xuejun Fan, H.B. Wang, T.B. Lim · IEEE Transactions on Components and Packaging Technologies · 2001 · 88 citations

Engineering, Underfill Delamination, Mechanical Engineering +16

A Micromechanics-Based Vapor Pressure Model in Electronic Packages

Xuejun Fan, Jiang Zhou, G. Q. Zhang et al. · Journal of Electronic Packaging · 2004 · 70 citations

Engineering, Micromechanics, Initial Vapor Pressure +23

Prediction and verification of process induced warpage of electronic packages

W.D. van Driel, G. Q. Zhang, J.H.J. Janssen et al. · Microelectronics Reliability · 2003 · 56 citations

Industrial Design, Chip-scale Package, Engineering +10