Concepedia

Package Modeling

Package Modeling is a computational or theoretical framework that characterizes the electrical, thermal, and electromagnetic behavior of integrated circuit packages by integrating structural, material, and interface properties specific to chip and microwave packaging technologies.

288

Publications

7.5K

Citations

822

Authors

246

Institutions

Publications per year

2017–2026

21

Parents

Publications

288

Development of a thermal resistance model for chip-on-board packaging of high power LED arrays

Minseok Ha, Samuel Graham · Microelectronics Reliability · 2012 · 149 citations

, , +16

A Fast Algorithm and Practical Considerations for Passive Macromodeling of Measured/Simulated Data

D. Saraswat, Ramachandra Achar, M. Nakhla · IEEE Transactions on Advanced Packaging · 2004 · 148 citations

, , +16

Package macromodeling via time-domain vector fitting

S. Grivet‐Talocia · IEEE Microwave and Wireless Components Letters · 2003 · 141 citations · Full text

, , +17

Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry

Bongtae Han, Yifan Guo · Journal of Electronic Packaging · 1995 · 118 citations

, , +15

Accurate, Pre-RTL Temperature-Aware Design Using a Parameterized, Geometric Thermal Model

Wei Huang, Karthik Sankaranarayanan, Kevin Skadron et al. · IEEE Transactions on Computers · 2008 · 111 citations

, , +15

1–5 of 288

Authors

822

  1. MR
    M. Rencz

    Budapest University of Technology and Economics, Hungary

    7 publications · 290 citations

    7

    h-index

  2. AP
    A. Poppe

    Budapest University of Technology and Economics, Hungary

    6 publications · 171 citations

    6

    h-index

  3. JH
    John H. Lau

    Industrial Technology Research Institute, Taiwan

    6 publications · 178 citations

    6

    h-index

  4. LC
    Lorenzo Codecasa

    Politecnico di Milano, Italy

    6 publications · 189 citations

    6

    h-index

  5. TH
    Tzyy‐Sheng Horng

    National Sun Yat-sen University, Taiwan

    5 publications · 73 citations

    5

    h-index

1–5 of 822

Institutions

246

  1. Georgia Institute of Technology

    Atlanta, United States

    13 h-index

    49 publications

    1.3K citations

  2. Motorola (United States)

    Schaumburg, United States

    12 h-index

    32 publications

    863 citations

  3. Intel (United States)

    Santa Clara, United States

    11 h-index

    14 publications

    386 citations

  4. IBM (United States)

    Armonk, United States

    10 h-index

    25 publications

    786 citations

  5. Amkor Technology (United States)

    Tempe, United States

    10 h-index

    22 publications

    649 citations

  6. Advanced Semiconductor Engineering (Taiwan)

    Kaohsiung, Taiwan

    9 h-index

    22 publications

    379 citations

  7. Institute of Microelectronics

    Singapore, Singapore

    8 h-index

    19 publications

    433 citations

  8. Fraunhofer Institute for Reliability and Microintegration

    Berlin, Germany

    7 h-index

    25 publications

    611 citations

1–8 of 246

Venues

  1. Microelectronics Reliability

    15 publications · 564 citations

    14

    h-index

  2. 12

    h-index

  3. IEEE Transactions on Advanced Packaging

    11 publications · 366 citations

    11

    h-index

  4. Journal of Electronic Packaging

    11 publications · 327 citations

    11

    h-index

  5. 8

    h-index

1–5