Concepedia

H.B. Wang

HW

Statistics

Publications

2

Citations

101

H-Index

2

Active since

2001

Affiliations

Institute of Microelectronics(Current)

STMicroelectronics (Singapore)

H.B. Wang is an author at Institute of Microelectronics specializing in electronic packaging, mechanics of materials, and microelectronics.

Top concepts

Publications per year

2001–2003

2

Publications

2

Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading

Xuejun Fan, H.B. Wang, T.B. Lim · IEEE Transactions on Components and Packaging Technologies · 2001 · 88 citations

, , +16

Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading

Xuejun Fan, H.B. Wang, T.B. Lim · 2003 · 13 citations

, , +16

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