Concepedia

H.B. Wang

HW

2

Publications

101

Citations

2

H-Index

2001

Active since

Affiliations

Institute of Microelectronics(Current)

STMicroelectronics (Singapore)

H.B. Wang is an author at Institute of Microelectronics specializing in electronic packaging, mechanics of materials, and microelectronics.

Top concepts

EngineeringSolid MechanicsMaterial ScienceMicroelectronicsElectronic PackagingMechanical EngineeringMechanics Of Materials

Publications per year

2001–2003

2

Publications

2

Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading

Xuejun Fan, H.B. Wang, T.B. Lim · IEEE Transactions on Components and Packaging Technologies · 2001 · 88 citations

Engineering, Underfill Delamination, Mechanical Engineering +16

Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading

Xuejun Fan, H.B. Wang, T.B. Lim · 2003 · 13 citations

Engineering, Underfill Delamination, Mechanical Engineering +16

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