T.B. Lim

The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging

E.H. Wong, K.C. Chan, R. Rajoo et al. · 2002 · 145 citations

Engineering, Mechanical Engineering, Hygroscopic Swelling +20

The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging

E.H. Wong, R. Rajoo, Sau Koh et al. · Journal of Electronic Packaging · 2002 · 120 citations

Engineering, Mechanical Engineering, Hygroscopic Swelling +18

Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading

Xuejun Fan, H.B. Wang, T.B. Lim · IEEE Transactions on Components and Packaging Technologies · 2001 · 88 citations

Engineering, Underfill Delamination, Mechanical Engineering +16

Predicting delamination in plastic IC packages and determining suitable mold compound properties

A.A.O. Tay, G.L. Tan, T.B. Lim · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1994 · 78 citations

Engineering, Mechanical Engineering, Mechanics Of Materials +18

Surface structures and adhesion enhancement of poly(tetrafluoroethylene) films after modification by graft copolymerization with glycidyl methacrylate

Tie Wang, E. T. Kang, K. G. Neoh et al. · Journal of Adhesion Science and Technology · 1997 · 57 citations