T.B. Lim - Concepedia

Author

T.B. Lim

Institute of Microelectronics

Also Known As

T B Lim, T. B. LIM, T. B. Lim, T.-B. Lim, T.B Lim, T.B. Lim, T.b. Lim, Taegyeong Lim, Thiam Ben Lim, Thiam Beng Lim

Publications

Citations

H-Index

Concepts

All Affiliations

Institute of Microelectronics National University of Singapore Singapore Science Park Texas Instruments (United States)The University of Sydney

About

T.B. Lim is an author at Institute of Microelectronics specializing in engineering, materials science, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	17	23	893
2	Natural Sciences	1	1	33
3	Public Health	1	1	27
4	Applied Physics	1	1	42
5	Biomedical Engineering	1	1	17

T.B. Lim

Publications

961

Citations

H-Index

Page 1

	Year	Citations
The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging E.H. Wong, K.C. Chan, R. Rajoo, EngineeringMechanical EngineeringHygroscopic SwellingHygroscopic StressAdvanced Packaging (Semiconductors)	2002	145
The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging E.H. Wong, R. Rajoo, Sau Koh, Journal of Electronic Packaging EngineeringMechanical EngineeringHygroscopic SwellingHygroscopic StressAdvanced Packaging (Semiconductors)	2002	120
Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading Xuejun Fan, H.B. Wang, T.B. Lim IEEE Transactions on Components and Packaging Technologies EngineeringUnderfill DelaminationMechanical EngineeringAdvanced Packaging (Semiconductors)Underfilled Solder Ball	2001	88
Predicting delamination in plastic IC packages and determining suitable mold compound properties A.A.O. Tay, G.L. Tan, T.B. Lim IEEE Transactions on Components Packaging and Manufacturing Technology Part B EngineeringMechanical EngineeringMechanics Of MaterialsThermoplastic CompositeMolding (Process)	1994	78
Surface structures and adhesion enhancement of poly(tetrafluoroethylene) films after modification by graft copolymerization with glycidyl methacrylate Tie Wang, E. T. Kang, K. G. Neoh, Journal of Adhesion Science and Technology	1997	57
A thermodynamic model for the analysis of screw expander performance Kim Choon Ng, T.Y. Bong, T.B. Lim Heat Recovery Systems and CHP Materials ScienceThermodynamic ModellingEngineeringThermodynamic ModelMechanical Engineering	1990	54
Low-temperature graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils—effect of crosslinking agents A. K. S. Ang, E. T. Kang, K. G. Neoh, Polymer Materials ScienceLow-temperature Graft CopolymerizationChemical EngineeringEngineeringPolymer Technology	2000	46
Non-Fickian moisture properties characterisation and diffusion modeling for electronic packages E.H. Wong, K.C. Chan, T.B. Lim, Ic Packaging MaterialsMoisture DiffusionFood PackagingEngineeringMechanical Engineering	2003	42
A three-dimensional modeling of wire sweep incorporating resin cure Jichuan Wu, A.A.O. Tay, K. S. Yeo, IEEE Transactions on Components Packaging and Manufacturing Technology Part B Transfer MoldingElectrical EngineeringEngineeringNatural SciencesMechanical Engineering	1998	33
Underfill swelling and temperature-humidity performance of flip chip PBGA package E.H. Wong, Sau Koh, R. Rajoo, Electrical EngineeringChip-scale PackageEngineeringTemperature-humidity PerformanceAdvanced Packaging (Semiconductors)	2002	33

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