Concepedia

Yuhai Mei

YM

Statistics

Publications

5

Citations

264

H-Index

5

Active since

1994

Affiliations

Florida Institute of Technology(Current)

Wayne State University

Yuhai Mei is an author at Florida Institute of Technology specializing in mechanics of materials, engineering, and electronic packaging.

Top concepts

EngineeringSolid MechanicsMaterial ScienceElectronic PackagingMechanical EngineeringMechanics Of MaterialsMechanical BehaviorMechanicsPlasticity3D Printing

Publications per year

1994–2000

5

Publications

5

Behavior of delaminated plastic IC packages subjected to encapsulation cooling, moisture absorption, and wave soldering

Sheng Liu, Yuhai Mei · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1995 · 115 citations

Engineering, Food Packaging, Mechanical Engineering +22

Bimaterial interfacial crack growth as a function of mode-mixity

Sheng Liu, Yuhai Mei, T. Y. Wu · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1995 · 105 citations

Materials Science, Energy Release Rate, Engineering +15

Effects of Voids and Their Interactions on SMT Solder Joint Reliability

S. Liu, Yuhai Mei · Soldering and Surface Mount Technology · 1994 · 21 citations

Engineering, Mechanical Engineering, Defect Tolerance +19

Stress evolution in a conductive adhesive during curing and cooling.

Yuhai Mei · Deep Blue (University of Michigan) · 2000 · 12 citations

An Investigation to Popcorning Mechanisms for IC Plastic Packages: EMC Cracking

S. Liu, Yuhai Mei · 1995 · 11 citations

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