Concepedia

T. Y. Wu

TY

4

Publications

354

Citations

4

H-Index

1993

Active since

Affiliations

Endicott College(Current)

T. Y. Wu is an author at Endicott College specializing in electronic packaging, mechanical engineering, and engineering.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMechanical EngineeringSolid MechanicsThermal EngineeringMechanics Of MaterialsMechanics3D PrintingHeat Transfer

Publications per year

1993–2002

4

Publications

4

Bimaterial interfacial crack growth as a function of mode-mixity

Sheng Liu, Yuhai Mei, T. Y. Wu · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1995 · 105 citations

Materials Science, Energy Release Rate, Engineering +15

Materials and mechanics issues in flip-chip organic packaging

T. Y. Wu, Y. Tsukada, W.T. Chen · 2002 · 104 citations

Flip Chip Technology, Engineering, Mechanical Engineering +16

Encapsulants used in flip-chip packages

D. Suryanarayana, T. Y. Wu, J.A. Varcoe · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1993 · 93 citations

Engineering, Mechanical Engineering, Flip-chip Packages +19

Thermal-mechanical strain characterization for printed wiring boards

T. Y. Wu, Yifan Guo, W. T. Chen · IBM Journal of Research and Development · 1993 · 52 citations

Materials Science, Wiring Boards, Engineering +14

Rows per page

1–4 of 4