J.A. Varcoe

Encapsulants used in flip-chip packages

D. Suryanarayana, T. Y. Wu, J.A. Varcoe · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1993 · 93 citations

Engineering, Mechanical Engineering, Flip-chip Packages +19

Flip-chip encapsulation on ceramic substrates

J. Clementi, J.M. McCreary, Tyan-Min Niu et al. · 2002 · 65 citations

Engineering, Mechanical Engineering, Computer Architecture +16

Repairability of underfill encapsulated flip-chip packages

D. Suryanarayana, J.A. Varcoe, J.V. Ellerson · 2002 · 30 citations

Materials Science, Chip-scale Package, Engineering +13

Flip-chip soldering to bare copper circuits

A.P. Ingraham, J.M. McCreary, J.A. Varcoe · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1990 · 12 citations

Advanced Packaging, Materials Science, Copper Circuitry +15