Tyan-Min Niu is an author at IBM (United States) specializing in mechanical engineering, materials science, and engineering.
Top concepts
EngineeringMaterial ScienceMechanical EngineeringHeat TransferSolid MechanicsCarbon MaterialsMicroelectronicsTensile MechanicsMechanical BehaviorThermal Engineering
Publications per year
1982–2002
2
2
Flip-chip encapsulation on ceramic substrates
J. Clementi, J.M. McCreary, Tyan-Min Niu et al. · 2002 · 65 citations
Engineering, Mechanical Engineering, Computer Architecture +16
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