Concepedia

Myongseob Kim

MK

6

Publications

144

Citations

6

H-Index

2000

Active since

Affiliations

Xilinx (United States)(Current)

Myongseob Kim is an author at Xilinx (United States) specializing in engineering, electronic packaging, and electrical engineering.

Top concepts

EngineeringMicroelectronicsMicrofabricationComputer EngineeringElectronic PackagingElectrical EngineeringAdvanced PackagingIntegrated CircuitsComputer ArchitectureThree-dimensional Heterogeneous Integration

Publications per year

2000–2020

6

Publications

6

Outstanding and innovative reliability study of 3D TSV interposer and fine pitch solder micro-bumps

Bahareh Banijamali, Suresh Ramalingam, Henley Liu et al. · 2012 · 48 citations

Innovative Reliability Study, Engineering, Power Electronics +16

Enabling a Manufacturable 3D Technologies and Ecosystem using 28nm FPGA with Stack Silicon Interconnect Technology

Woon‐Seong Kwon, Myongseob Kim, Jonathan Chang et al. · IMAPSource Proceedings · 2013 · 26 citations

Engineering, Manufacturable 3D, Computer Architecture +20

Reliability evaluation of an extreme TSV interposer and interconnects for the 20nm technology CoWoS IC package

Bahareh Banijamali, Tom Lee, Henley Liu et al. · 2015 · 23 citations

Engineering, Extreme Tsv Interposer, Integrated Circuits +18

Process and device characteristics of self-assembled metal nano-crystal EEPROM

Zengtao Liu, Myongseob Kim, Venkat Narayanan et al. · Superlattices and Microstructures · 2000 · 21 citations

Materials Science, Engineering, Nanomaterials +5

Assembly process qualification and reliability evaluations for heterogeneous 2.5D FPGA with HiCTE Ceramic

Ganesh Hariharan, Raghunandan Chaware, Laurene Yip et al. · 2013 · 15 citations

Engineering, Vlsi Design, Device Integration +22

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