Statistics
Publications
13
Citations
293
H-Index
12
Active since
1989
Affiliations
Laurene Yip is an author at Xilinx (United States) specializing in packaging design, engineering, and computer engineering.
Publications per year
1989–2023
13
13
A comprehensive reliability study on a CoWoS 3D IC package
Ganesh Hariharan, Raghunandan Chaware, Inderjit Singh et al. · 2015 · 31 citations
Reliability Challenges of High-Density Fan-out Packaging for High-Performance Computing Applications
Laurene Yip, Rosa Lin, Charles Pin‐Kuang Lai et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 30 citations
Engineering, Computer Engineering, High-performance Computing +17
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