Laurene Yip

Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power Cycling

Shuai Shao, Yuling Niu, Jing Wang et al. · 2018 · 47 citations

Engineering, Energy Efficiency, Maximum Junction Temperature +19

A comprehensive reliability study on a CoWoS 3D IC package

Ganesh Hariharan, Raghunandan Chaware, Inderjit Singh et al. · 2015 · 31 citations

Stacked Die Side, Engineering, Computer Architecture +17

Method of avoiding ampoule adhesion of ingots in Bridgman growth of CuInSe2

Laurene Yip, I. Shih, C.H. Champness · Journal of Crystal Growth · 1993 · 30 citations

Materials Science, Ampoule Adhesion, Bridgman Growth +1

Reliability Challenges of High-Density Fan-out Packaging for High-Performance Computing Applications

Laurene Yip, Rosa Lin, Charles Pin‐Kuang Lai et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 27 citations

Engineering, Computer Architecture, Refrigeration +20

Reliability evaluation of an extreme TSV interposer and interconnects for the 20nm technology CoWoS IC package

Bahareh Banijamali, Tom Lee, Henley Liu et al. · 2015 · 23 citations

Engineering, Extreme Tsv Interposer, Integrated Circuits +18