Raghunandan Chaware

Assembly and reliability challenges in 3D integration of 28nm FPGA die on a large high density 65nm passive interposer

Raghunandan Chaware, K. V. Nagarajan, Suresh Ramalingam · 2012 · 142 citations

Engineering, Computer Engineering, Electrical Engineering +17

A comprehensive reliability study on a CoWoS 3D IC package

Ganesh Hariharan, Raghunandan Chaware, Inderjit Singh et al. · 2015 · 31 citations

Engineering, Computer Engineering, Computer Science +17

Assembly challenges in developing 3D IC package with ultra high yield and high reliability

Raghunandan Chaware, Ganesh Hariharan, Jeff Lin et al. · 2015 · 28 citations

Engineering, Computer Engineering, Field-programmable Gate Arrays +16

Assembly process qualification and reliability evaluations for heterogeneous 2.5D FPGA with HiCTE Ceramic

Ganesh Hariharan, Raghunandan Chaware, Laurene Yip et al. · 2013 · 15 citations

Engineering, Computer Engineering, Electrical Engineering +17

Assembly process integration challenges and reliability assessment of multiple 28nm FPGAs assembled on a Large 65nm passive interposer

Raghunandan Chaware, K. V. Nagarajan, Kenny Ng et al. · 2012 · 14 citations

Engineering, Computer Engineering, Electrical Engineering +17