Concepedia

Raghunandan Chaware

RC

Statistics

Publications

5

Citations

226

H-Index

5

Active since

2012

Affiliations

Xilinx (United States)(Current)

Raghunandan Chaware is an author at Xilinx (United States) specializing in computer engineering, electronic packaging, and microelectronics.

Top concepts

EngineeringMicroelectronicsComputer EngineeringElectronic PackagingComputer Architecture3D IntegrationMicrofabricationAdvanced PackagingElectrical EngineeringThree-dimensional Heterogeneous Integration

Publications per year

2012–2015

5

Publications

5

Assembly and reliability challenges in 3D integration of 28nm FPGA die on a large high density 65nm passive interposer

Raghunandan Chaware, K. V. Nagarajan, Suresh Ramalingam · 2012 · 139 citations

Engineering, Computer Architecture, Best Assembly Process +19

A comprehensive reliability study on a CoWoS 3D IC package

Ganesh Hariharan, Raghunandan Chaware, Inderjit Singh et al. · 2015 · 31 citations

Stacked Die Side, Engineering, Computer Architecture +17

Assembly challenges in developing 3D IC package with ultra high yield and high reliability

Raghunandan Chaware, Ganesh Hariharan, Jeff Lin et al. · 2015 · 27 citations

Engineering, Computer Architecture, Ultra High Yield +21

Assembly process qualification and reliability evaluations for heterogeneous 2.5D FPGA with HiCTE Ceramic

Ganesh Hariharan, Raghunandan Chaware, Laurene Yip et al. · 2013 · 15 citations

Engineering, Vlsi Design, Device Integration +22

Assembly process integration challenges and reliability assessment of multiple 28nm FPGAs assembled on a Large 65nm passive interposer

Raghunandan Chaware, K. V. Nagarajan, Kenny Ng et al. · 2012 · 14 citations

Engineering, Reliability Assessment, Computer Architecture +20

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