Suresh Ramalingam

Advanced reliability study of TSV interposers and interconnects for the 28nm technology FPGA

Bahareh Banijamali, Suresh Ramalingam, K. V. Nagarajan et al. · 2011 · 176 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +21

Assembly and reliability challenges in 3D integration of 28nm FPGA die on a large high density 65nm passive interposer

Raghunandan Chaware, K. V. Nagarajan, Suresh Ramalingam · 2012 · 139 citations

Engineering, Computer Architecture, Best Assembly Process +19

Reliability evaluation of a CoWoS-enabled 3D IC package

Bahareh Banijamali, Chien‐Chia Chiu, Cheng‐Chieh Hsieh et al. · 2013 · 64 citations

Engineering, Mechanical Engineering, Computer Architecture +19

Outstanding and innovative reliability study of 3D TSV interposer and fine pitch solder micro-bumps

Bahareh Banijamali, Suresh Ramalingam, Henley Liu et al. · 2012 · 48 citations

Innovative Reliability Study, Engineering, Power Electronics +16

Warpage and Reliability Challenges for Stacked Silicon Interconnect Technology in Large Packages

Scott McCann, Ho Hyung Lee, Gamal Refai-Ahmed et al. · 2018 · 42 citations

Engineering, Vlsi Design, Computer Architecture +17