Cheng‐Chieh Hsieh

Statistics

Publications

Citations

679

H-Index

Active since

2001

Affiliations

Taiwan Semiconductor Manufacturing Company (Taiwan)(Current)

Carnegie Mellon University

Cheng‐Chieh Hsieh is an author at Taiwan Semiconductor Manufacturing Company (Taiwan) specializing in engineering, packaging design, and chip packaging.

ORCID

Publications per year

2001–2016

Publications

Evaporative heat transfer characteristics of a water spray on micro-structured silicon surfaces

Cheng‐Chieh Hsieh, Shi‐Chune Yao · International Journal of Heat and Mass Transfer · 2005 · 174 citations

Engineering, Materials Science, Mechanical Engineering +15

Micro-electro-mechanical systems (MEMS)-based micro-scale direct methanol fuel cell development

Shi‐Chune Yao, Xudong Tang, Cheng‐Chieh Hsieh et al. · Energy · 2005 · 145 citations

Engineering, Chemical Engineering, Mechanical Engineering +12

High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration

Christianto C. Liu, Shuo-Mao Chen, Feng-Wei Kuo et al. · 2012 · 127 citations

Engineering, Electrical Engineering, Microelectronics +16

MEMS-enabled thermal management of high-heat-flux devices EDIFICE: embedded droplet impingement for integrated cooling of electronics

Cristina H. Amon, Jayathi Y. Murthy, S. C. Yao et al. · Experimental Thermal and Fluid Science · 2001 · 127 citations

Engineering, Electrical Engineering, Mechanical Engineering +17

Reliability evaluation of a CoWoS-enabled 3D IC package

Bahareh Banijamali, Chien‐Chia Chiu, Cheng‐Chieh Hsieh et al. · 2013 · 65 citations

Engineering, Computer Engineering, Computer-integrated Manufacturing +16

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