Feng-Wei Kuo

Statistics

Publications

Citations

649

H-Index

Active since

1988

Affiliations

Taiwan Semiconductor Manufacturing Company (Taiwan)(Current)

University College Dublin

Delft University of Technology

Hypres (United States)

Universidade Federal do Rio Grande do Sul

Feng-Wei Kuo is an author at Taiwan Semiconductor Manufacturing Company (Taiwan) specializing in engineering, electrical engineering, and microelectronics.

ORCID

Publications per year

1988–2023

Publications

High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration

Christianto C. Liu, Shuo-Mao Chen, Feng-Wei Kuo et al. · 2012 · 127 citations

Engineering, Electrical Engineering, Microelectronics +16

A Bluetooth Low-Energy Transceiver With 3.7-mW All-Digital Transmitter, 2.75-mW High-IF Discrete-Time Receiver, and TX/RX Switchable On-Chip Matching Network

Feng-Wei Kuo, Sandro Binsfeld Ferreira, Huan-Neng Ron Chen et al. · IEEE Journal of Solid-State Circuits · 2017 · 124 citations

Engineering, Computer Engineering, Electrical Engineering +17

A Fully Integrated Bluetooth Low-Energy Transmitter in 28 nm CMOS With 36% System Efficiency at 3 dBm

Masoud Babaie, Feng-Wei Kuo, Huan-Neng Ron Chen et al. · IEEE Journal of Solid-State Circuits · 2016 · 95 citations · Full text

Engineering, Electrical Engineering, Low-power Design +16

A 0.5-V 1.6-mW 2.4-GHz Fractional-N All-Digital PLL for Bluetooth LE With PVT-Insensitive TDC Using Switched-Capacitor Doubler in 28-nm CMOS

Naser Pourmousavian, Feng-Wei Kuo, Teerachot Siriburanon et al. · IEEE Journal of Solid-State Circuits · 2018 · 60 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

A 12mW all-digital PLL based on class-F DCO for 4G phones in 28nm CMOS

Feng-Wei Kuo, Chen Ron, Kyle Yen et al. · 2014 · 33 citations

Engineering, Computer Engineering, Electrical Engineering +17

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