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MEMS-enabled thermal management of high-heat-flux devices EDIFICE: embedded droplet impingement for integrated cooling of electronics

Mems-enabled Thermal ManagementIntegrated CoolingElectrical EngineeringEngineeringThermal ProtectionAdvanced Packaging (Semiconductors)MicrofabricationDroplet ImpingementHeat Transfer EnhancementThermal ManagementThermal ModelingThermodynamicsElectronic PackagingHeat TransferMicroelectronicsThermal Engineering