Concepedia
Statistics
Publications
9
Citations
190
H-Index
Active since
1995
Affiliations
National Tsing Hua University(Current)
Taiwan Semiconductor Manufacturing Company (Taiwan)
Industrial Technology Research Institute
Chien‐Chia Chiu is an author at National Tsing Hua University specializing in materials engineering, engineering, and materials science.
Publications per year
1995–2013
Reliability evaluation of a CoWoS-enabled 3D IC package
Bahareh Banijamali, Chien‐Chia Chiu, Cheng‐Chieh Hsieh et al. · 2013 · 65 citations
Engineering, Computer Engineering, Computer-integrated Manufacturing +16
Thermal diffusivity, heat capacity and thermal conductivity in Al2O3Ni composite
Dean‐Mo Liu, Wei‐Hsing Tuan, Chien‐Chia Chiu · Materials Science and Engineering B · 1995 · 30 citations
Natural Sciences, Materials Engineering, Materials Science +16
The Geometrical Effects of Bumps on the Fatigue Life of Flip-chip Packages by Taguchi Method
Wen‐Ren Jong, Shia‐Chung Chen, Hsin-Chun Tsai et al. · Journal of Reinforced Plastics and Composites · 2006 · 25 citations
Engineering, Materials Engineering, Mechanical Engineering +17
Interfacial Fracture Analysis of CMOS Cu/Low-$k$ BEOL Interconnect in Advanced Packaging Structures
Chang‐Chun Lee, Chien‐Chia Chiu, Chin-Chiu Hsia et al. · IEEE Transactions on Advanced Packaging · 2009 · 16 citations
Engineering, Electrical Engineering, Materials Engineering +17
Cracking energy estimation of ultra low-k package using novel prediction approach combined with global–local modeling technique
Chang‐Chun Lee, Tsung-Lin Chou, Chien‐Chia Chiu et al. · Microelectronic Engineering · 2008 · 12 citations
Engineering, Materials Engineering, Materials Science +17
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