Concepedia

Bahareh Banijamali

BB

9

Publications

428

Citations

9

H-Index

2006

Active since

Affiliations

Xilinx (United States)(Current)

Bahareh Banijamali is an author at Xilinx (United States) specializing in engineering, microelectronics, and electronic packaging.

Top concepts

EngineeringMicroelectronicsElectronic PackagingComputer EngineeringElectrical EngineeringMicrofabricationAdvanced PackagingIntegrated CircuitsThree-dimensional Heterogeneous IntegrationComputer Architecture

Publications per year

2006–2015

9

Publications

9

Advanced reliability study of TSV interposers and interconnects for the 28nm technology FPGA

Bahareh Banijamali, Suresh Ramalingam, K. V. Nagarajan et al. · 2011 · 176 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +21

Reliability evaluation of a CoWoS-enabled 3D IC package

Bahareh Banijamali, Chien‐Chia Chiu, Cheng‐Chieh Hsieh et al. · 2013 · 64 citations

Engineering, Mechanical Engineering, Computer Architecture +19

Outstanding and innovative reliability study of 3D TSV interposer and fine pitch solder micro-bumps

Bahareh Banijamali, Suresh Ramalingam, Henley Liu et al. · 2012 · 48 citations

Innovative Reliability Study, Engineering, Power Electronics +16

Ceramics vs. low-CTE organic packaging of TSV silicon interposers

Bahareh Banijamali, Suresh Ramalingam, Nam‐Hoon Kim et al. · 2011 · 39 citations

Materials Science, Advanced Packaging, Bump Fatigue +15

Reliability evaluation of an extreme TSV interposer and interconnects for the 20nm technology CoWoS IC package

Bahareh Banijamali, Tom Lee, Henley Liu et al. · 2015 · 23 citations

Engineering, Extreme Tsv Interposer, Integrated Circuits +18

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