Concepedia

Bahareh Banijamali

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Statistics

Publications

9

Citations

432

H-Index

9

Active since

2006

Affiliations

Xilinx (United States)(Current)

Bahareh Banijamali is an author at Xilinx (United States) specializing in engineering, integrated circuit design, and chip packaging.

Publications per year

2006–2015

9

Publications

9

Advanced reliability study of TSV interposers and interconnects for the 28nm technology FPGA

Bahareh Banijamali, Suresh Ramalingam, K. V. Nagarajan et al. · 2011 · 179 citations

Engineering, Computer Engineering, Electrical Engineering +17

Reliability evaluation of a CoWoS-enabled 3D IC package

Bahareh Banijamali, Chien‐Chia Chiu, Cheng‐Chieh Hsieh et al. · 2013 · 65 citations

Engineering, Computer Engineering, Computer-integrated Manufacturing +16

Outstanding and innovative reliability study of 3D TSV interposer and fine pitch solder micro-bumps

Bahareh Banijamali, Suresh Ramalingam, Henley Liu et al. · 2012 · 48 citations

Engineering, Electrical Engineering, Materials Science +17

Ceramics vs. low-CTE organic packaging of TSV silicon interposers

Bahareh Banijamali, Suresh Ramalingam, Nam‐Hoon Kim et al. · 2011 · 39 citations

Natural Sciences, Materials Engineering, Materials Science +15

Reliability evaluation of an extreme TSV interposer and interconnects for the 20nm technology CoWoS IC package

Bahareh Banijamali, Tom Lee, Henley Liu et al. · 2015 · 23 citations

Engineering, Computer Engineering, Electrical Engineering +17

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