K. V. Nagarajan

Advanced reliability study of TSV interposers and interconnects for the 28nm technology FPGA

Bahareh Banijamali, Suresh Ramalingam, K. V. Nagarajan et al. · 2011 · 176 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +21

Assembly and reliability challenges in 3D integration of 28nm FPGA die on a large high density 65nm passive interposer

Raghunandan Chaware, K. V. Nagarajan, Suresh Ramalingam · 2012 · 139 citations

Engineering, Computer Architecture, Best Assembly Process +19

Effect of aging on microstructure and mechanical properties of cobalt free 18%Ni (250 grade) maraging steel

P. P. Sinha, K. Thomas Tharian, K. V. Nagarajan et al. · Materials Science and Technology · 1998 · 79 citations

Materials Science, Engineering, Mechanical Properties +12

Development of heat treatment parameters to improve fracture toughness and grain size of an embrittled maraging steel

P. P. Sinha, Narendra Babu, Bhanu Pant et al. · Journal of Heat Treating · 1992 · 17 citations

Materials Science, Engineering, Fracture Toughness +9

Grain growth in 18Ni 1800 MPa maraging steel

P. P. Sinha, K. V. Nagarajan · Journal of Materials Science · 1991 · 15 citations

Materials Science, Engineering, Grain Growth +3