Gamal Refai-Ahmed

Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power Cycling

Shuai Shao, Yuling Niu, Jing Wang et al. · 2018 · 47 citations

Engineering, Computer Engineering, Materials Engineering +17

Warpage and Reliability Challenges for Stacked Silicon Interconnect Technology in Large Packages

Scott McCann, Ho Hyung Lee, Gamal Refai-Ahmed et al. · 2018 · 44 citations

Engineering, Computer Engineering, Electrical Engineering +16

Scientific and Engineering Computing Using ATI Stream Technology

Amr M. Bayoumi, Michael Chu, Yasser Y. Hanafy et al. · Computing in Science & Engineering · 2009 · 32 citations

Computing, Computer Science, High-performance Computing +12

High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices

Maxat Touzelbaev, Josef Miler, Yizhang Yang et al. · Journal of Electronic Packaging · 2013 · 26 citations

Engineering, Computer Engineering, Electrical Engineering +17

Simplified Analytical Models for Forced Convection Heat Transfer From Cuboids of Arbitrary Shape

J. R. Culham, M. M. Yovanovich, P. Teertstra et al. · Journal of Electronic Packaging · 2000 · 25 citations

Engineering, Mechanical Engineering, Physics +17