Ho Hyung Lee is an author at Xilinx (United States) specializing in engineering, electronic packaging, and microelectronics.
Top concepts
EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringVlsi DesignApplied PhysicsElectrochemistryHardware SystemsMaterial ScienceMicrofabrication
Publications per year
2018–2018
2
2
The Expermental and Numerical Study of Electromigration in 2.5D Packaging
Jiefeng Xu, Yuling Niu, Stephen R. Cain et al. · 2018 · 16 citations
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