An investigation into the effects of probing and wire bonding stress on the reliability of BOAC - Concepedia

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An investigation into the effects of probing and wire bonding stress on the reliability of BOAC

11

Citations

2

References

2005

Year

K.M. Chen, Bian Wu, Kai Tang, Fu-Chen Cheng, Nicholas Kao, J.Y. Lai

Microelectronics Reliability

Materials ScienceStructural IntegrityEngineeringMechanical EngineeringElectronic PackagingWire Bonding StressMechanics Of Materials

References

	Year	Citations

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