Wen-Tsung Tseng

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Active since

2011

Affiliations

Siliconware Precision Industries (Taiwan)(Current)

Wen-Tsung Tseng is an author at Siliconware Precision Industries (Taiwan) specializing in chip packaging, integrated circuit design, and materials science.

Publications per year

2011–2016

Publications

Development of Non-TSV Interposer (NTI) for High Electrical Performance Package

Fang-Yu Liang, Hung-Hsien Chang, Wen-Tsung Tseng et al. · 2016 · 17 citations

Engineering, Electrical Engineering, Materials Science +17

Development of thermal compression bonding with Non Conductive Paste for 3DIC fine pitch copper pillar bump interconnections

Chien-Feng Chan, Wen-Tsung Tseng, Huei-Nuan Huang et al. · 2011 · 13 citations

Engineering, Materials Engineering, Materials Science +16

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