Chien-Feng Chan

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

Aibin Yu, John H. Lau, Soon Wee Ho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 65 citations

Engineering, Electrical Engineering, Materials Science +17

Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps

Aibin Yu, John H. Lau, Soon Wee Ho et al. · 2009 · 51 citations

Engineering, Electrical Engineering, Materials Science +17

An intermetallic study of solder joints with Sn-Ag-Cu lead-free solder

Chien-Feng Chan, S. K. Lahiri, Peng Yuan et al. · 2002 · 14 citations

Natural Sciences, Materials Engineering, Materials Science +15

Development of thermal compression bonding with Non Conductive Paste for 3DIC fine pitch copper pillar bump interconnections

Chien-Feng Chan, Wen-Tsung Tseng, Huei-Nuan Huang et al. · 2011 · 13 citations

Engineering, Materials Engineering, Materials Science +16

Development of 25-$\mu{\rm m}$-Pitch Microbumps for 3-D Chip Stacking

Aibin Yu, Aditya Kumar, Soon Wee Ho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 10 citations

Engineering, Materials Engineering, Materials Science +16