Statistics
Publications
2
Citations
84
H-Index
2
Active since
2009
Tan Siow Pin is an author at Nanyang Technological University specializing in chip packaging, hermetic sealing, and semiconductor devices.
Publications per year
2009–2013
2
2
3D packaging with through ilicon via (TSV) for electrical and fluidic interconnections
Navas Khan, H.Y. Yu, Tan Siow Pin et al. · 2009 · 24 citations
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