H. Y. Li

Highly spectrum-selective ultraviolet photodetector based on p-NiO/n-IGZO thin film heterojunction structure

H. K. Li, T. P. Chen, S. G. Hu et al. · Optics Express · 2015 · 43 citations · Full text

Chemical Engineering, Photoelectric Sensor, Engineering +13

Wafer level warpage modeling methodology and characterization of TSV wafers

H. Y. Li, Xiaowu Zhang, Shan Gao et al. · 2011 · 26 citations

Materials Engineering, 3D Ic Architecture, Electrical Engineering +14

Application of contact theory to metal-metal bonding of silicon wafers

Hoi Liong Leong, Chee Lip Gan, Carl V. Thompson et al. · Journal of Applied Physics · 2007 · 21 citations

Engineering, Mechanical Engineering, Silicon On Insulator +20

Thermal reliability of fine pitch Cu-Cu bonding with self assembled monolayer (SAM) passivation for Wafer-on-Wafer 3D-Stacking

Lan Peng, H. Y. Li, D. F. Lim et al. · 2011 · 20 citations

Thermal Endurance, Engineering, Thermal Reliability +20

High density bump-less Cu-Cu bonding with enhanced quality achieved by pre-bonding temporary passivation for 3D wafer stacking

Lan Peng, H. Y. Li, D. F. Lim et al. · 2011 · 19 citations

Engineering, Face-to-face Stacking, Integrated Circuits +21