Hoi Liong Leong

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Active since

2007

Affiliations

Singapore-MIT Alliance for Research and Technology(Current)

Singapore Science Park

Massachusetts Institute of Technology

Institute of Microelectronics

Nanyang Technological University

Hoi Liong Leong is an author at Singapore-MIT Alliance for Research and Technology specializing in wafer bonding, materials engineering, and surface roughness.

Publications per year

2007–2009

Publications

Application of contact theory to metal-metal bonding of silicon wafers

Hoi Liong Leong, Chee Lip Gan, Carl V. Thompson et al. · Journal of Applied Physics · 2007 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +17

Experimental characterization and modeling of the contact resistance of Cu–Cu bonded interconnects

Hoi Liong Leong, Chee Lip Gan, Riko I Made et al. · Journal of Applied Physics · 2009 · 20 citations · Full text

Engineering, Materials Engineering, Materials Science +17

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