Shan Gao

Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication

A. Heryanto, Wahyuaji Narottama Putra, A. Trigg et al. · Journal of Electronic Materials · 2012 · 158 citations

Materials Science, Wafer Scale Processing, Engineering +11

Compact Wideband Equivalent-Circuit Model for Electrical Modeling of Through-Silicon Via

En‐Xiao Liu, Er‐Ping Li, Wei-Bin Ewe et al. · IEEE Transactions on Microwave Theory and Techniques · 2011 · 80 citations

Engineering, Integrated Circuits, Through-silicon Via +18

An M/G/1 queue with single working vacation and vacation interruption under Bernoulli schedule

Shan Gao, Zaiming Liu · Applied Mathematical Modelling · 2012 · 71 citations

Engineering, Scheduling Problem, Scheduling (Production Processes) +11

Development of Wafer-Level Warpage and Stress Modeling Methodology and Its Application in Process Optimization for TSV Wafers

Fa Xing, H.Y. Li, Xiaowu Zhang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 70 citations

Engineering, Mechanical Engineering, Wafer Stress +21

Reliability and availability analysis of a retrial system with mixed standbys and an unreliable repair facility

Shan Gao, Jinting Wang · Reliability Engineering & System Safety · 2020 · 66 citations

Reliability, Reliability Engineering, Availability +11