Concepedia

Author

Wai Yin Hnin

Institute of Microelectronics

Also Known As

W. Y. Hnin, W.Y. Hnin, Wai Hnin, Wai Yin Hnin

14

Publications

279

Citations

8

H-Index

28

Concepts

All Affiliations

Institute of MicroelectronicsAgency for Science, Technology and ResearchSingapore Institute of Manufacturing TechnologyIndustrial Technology Research InstituteInstitute of Materials Research and Engineering
WY

About

Wai Yin Hnin is an author at Institute of Microelectronics specializing in engineering, electronic packaging, and microfabrication.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

7

7

238

2

Electrical Engineering

6

6

210

3

Computer Engineering

3

3

77

4

Applied Physics

2

2

93

5

Materials Engineering

1

1

28

Wai Yin Hnin

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7

Publications

238

Citations

7

H-Index

YearCitations

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

Aibin Yu, John H. Lau, Soon Wee Ho,

IEEE Transactions on Components Packaging and Manufacturing Technology

2011

65

Study of 15µm pitch solder microbumps for 3D IC integration

Aibin Yu, John H. Lau, Soon Wee Ho,

2009

57

Board level drop test reliability of IC packages

T.C. Chai, Ser Tong Quek, Wai Yin Hnin,

2005

41

Process Development and Reliability of Microbumps

Sharon Pei-Siang Lim, Vempati Srinivasa Rao, Wai Yin Hnin,

IEEE Transactions on Components and Packaging Technologies

2010

28

3D packaging with through ilicon via (TSV) for electrical and fluidic interconnections

Navas Khan, H.Y. Yu, Tan Siow Pin,

2009

23

Impact of packaging design on reliability of large die Cu/low-κ (BD) interconnect

T.C. Chai, Xiaowu Zhang, H.Y. Li,

2008

13

Reliability Performance of Stretch Solder Interconnections

Sung-Won Lim, R. Rajoo, E.H. Wong,

IEEE/CPMT International Electronics Manufacturing Technology Symposium

2006

11

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