Wai Yin Hnin

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

Aibin Yu, John H. Lau, Soon Wee Ho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 65 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +20

Study of 15µm pitch solder microbumps for 3D IC integration

Aibin Yu, John H. Lau, Soon Wee Ho et al. · 2009 · 57 citations

Engineering, Ultra Fine Pitch, Integrated Circuits +18

Board level drop test reliability of IC packages

T.C. Chai, Ser Tong Quek, Wai Yin Hnin et al. · 2005 · 41 citations

Engineering, Board Design, Impact Loading +21

Process Development and Reliability of Microbumps

Sharon Pei-Siang Lim, Vempati Srinivasa Rao, Wai Yin Hnin et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 28 citations

Engineering, Mechanical Engineering, Assembly Process Development +17

3D packaging with through ilicon via (TSV) for electrical and fluidic interconnections

Navas Khan, H.Y. Yu, Tan Siow Pin et al. · 2009 · 23 citations

Engineering, Chip Carrier, Liquid Metal Cooling +19