Statistics
Publications
3
Citations
38
H-Index
3
Active since
2004
Affiliations
Infineon Technologies (Singapore)(Current)
Tan Min is an author at Infineon Technologies (Singapore) specializing in chip packaging, electronic materials, and engineering.
Publications per year
2004–2010
3
3
Effect of substrate warpage on flip chip BGA thermal stress simulation
Chai Chee Meng, Stephan Stoeckl, H. Pape et al. · 2010 · 10 citations
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