H. Pape - Concepedia

Author

H. Pape

Infineon Technologies (Germany)

Also Known As

H Pape, H. PAPE, H. Pape, H.E. Pape, Heinz Pape

Publications

901

Citations

H-Index

Concepts

All Affiliations

Infineon Technologies (Germany)Fraunhofer Institute for Reliability and Microintegration Delft University of Technology Chemnitz University of Technology Angewandte Micro Messtechnik (Germany)

About

H. Pape is an author at Infineon Technologies (Germany) specializing in engineering, electronic packaging, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	15	29	733
2	Electrical Engineering	10	12	392
3	Applied Physics	6	6	200
4	Computer Engineering	4	4	96
5	Education	3	3	145

H. Pape

Publications

752

Citations

H-Index

Page 1

	Year	Citations
Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs G. Kelly, C. Lyden, W. Lawton, IEEE Transactions on Components Packaging and Manufacturing Technology Part B Materials ScienceResidual WarpageWarpage AnalysisEngineeringChip-scale Package	1996	95
Transient Measurement of the Junction-To-Case Thermal Resistance Using Structure Functions: Chances and Limits Dirk Schweitzer, H. Pape, Liu Chen Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings Case TemperatureEngineeringTransient MeasurementThermal ConductivityThermal Analysis	2008	89
Transient dual interface measurement &#x2014; A new JEDEC standard for the measurement of the junction-to-case thermal resistance Dirk Schweitzer, H. Pape, Liu Chen, New Jedec StandardEngineeringMeasurementJedec Standard Jesd51-14Education	2011	66
How to evaluate transient dual interface measurements of the Rth-JC of power semiconductor packages Dirk Schweitzer, H. Pape, Rudolf Kutscherauer, Case TemperatureTransient Dual InterfaceEngineeringMeasurementEducation	2009	47
Generation and verification of boundary independent compact thermal models for active components according to the DELPHI/SEED methods H. Pape, G. Noebauer Numerical AnalysisEngineeringSeed ProjectThermal ConductivityAdvanced Packaging (Semiconductors)	2003	41
Thermal Transient Modeling and Experimental Validation in the European Project PROFIT H. Pape, Dirk Schweitzer, J.H.J. Janssen, IEEE Transactions on Components and Packaging Technologies EngineeringExperimental ValidationEnergy EfficiencyHeat RecoveryEuropean Project Profit	2004	34
Development of a standard for transient measurement of junction-to-case thermal resistance H. Pape, Dirk Schweitzer, Liu Chen, Microelectronics Reliability Electrical EngineeringEngineeringMeasurementEducationThermal Analysis	2012	32
Delamination and combined compound cracking of EMC-copper interfaces An Xiao, Gerd Schlottig, H. Pape, Materials ScienceMaterials EngineeringInterface DelaminationElectromigration TechniqueEngineering	2010	27
Thermal expansion and Grüneisen parameter of polyethylene between 5 and 320 K I. Engeln, H. Pape Polymer Materials ScienceEngineeringPolymer ScienceMechanical EngineeringThermomechanical Analysis	1985	22
Thermal impact of randomly distributed solder voids on Rth-JC of MOSFETs Liu Chen, Mervi Paulasto‐Kröckel, U. Frohler, Electrical EngineeringReliability EngineeringEngineeringVoid DistributionSolder Voids	2008	22

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