H. Pape

Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs

G. Kelly, C. Lyden, W. Lawton et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1996 · 95 citations

Materials Science, Residual Warpage, Warpage Analysis +13

Transient Measurement of the Junction-To-Case Thermal Resistance Using Structure Functions: Chances and Limits

Dirk Schweitzer, H. Pape, Liu Chen · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings · 2008 · 89 citations

Case Temperature, Engineering, Transient Measurement +18

Transient dual interface measurement — A new JEDEC standard for the measurement of the junction-to-case thermal resistance

Dirk Schweitzer, H. Pape, Liu Chen et al. · 2011 · 66 citations

New Jedec Standard, Engineering, Measurement +20

How to evaluate transient dual interface measurements of the Rth-JC of power semiconductor packages

Dirk Schweitzer, H. Pape, Rudolf Kutscherauer et al. · 2009 · 47 citations

Case Temperature, Transient Dual Interface, Engineering +23

Generation and verification of boundary independent compact thermal models for active components according to the DELPHI/SEED methods

H. Pape, G. Noebauer · 2003 · 41 citations

Numerical Analysis, Engineering, Seed Project +22