G. Kelly

Statistics

Publications

Citations

301

H-Index

Active since

1995

Affiliations

National Microelectronics Applications Centre (Ireland)(Current)

University College Cork

G. Kelly is an author at National Microelectronics Applications Centre (Ireland) specializing in engineering, electronic packaging, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringPlasticitySolid MechanicsMaterial ScienceMechanics Of MaterialsMicroelectronicsMicrofabricationMicrofluidics

Publications per year

1995–2003

Publications

Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs

G. Kelly, C. Lyden, W. Lawton et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1996 · 95 citations

Materials Science, Residual Warpage, Warpage Analysis +13

Accurate prediction of PQFP warpage

G. Kelly, C. Lyden, W. Lawton et al. · 2002 · 37 citations

Engineering, Machine Learning, Mechanical Engineering +25

Microsystem packaging: lessons from conventional low cost IC packaging

G. Kelly, J. Alderman, C. Lyden et al. · Journal of Micromechanics and Microengineering · 1997 · 32 citations

Chip-scale Package, Engineering, Package Design +11

Development and characterisation of a surface micromachined FET pressure sensor on a CMOS process

E. Hynes, M. O'Neill, D. McAuliffe et al. · Sensors and Actuators A Physical · 1999 · 31 citations

Electrical Engineering, Engineering, Micromachines +10

An analyzer for detecting intermittent faults in electronic devices

Brent Sorensen, G. Kelly, A. Sajecki et al. · 2002 · 28 citations

Intermittent Faults, New Technologies, Engineering +18

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