1
Publications
10
Citations
1
H-Index
2010
Active since
Affiliations
Infineon Technologies (Germany)(Current)
Chai Chee Meng is an author at Infineon Technologies (Germany) specializing in microelectronics, thermal engineering, and integrated circuits.
Top concepts
EngineeringHeat TransferApplied PhysicsSolid MechanicsMicroelectronicsAdvanced PackagingIntegrated CircuitsThermal EngineeringComputer EngineeringElectronic Packaging
Publications per year
2010–2010
1
1
Effect of substrate warpage on flip chip BGA thermal stress simulation
Chai Chee Meng, Stephan Stoeckl, H. Pape et al. · 2010 · 10 citations
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