Concepedia

V.P. Ganesh

VG

11

Publications

331

Citations

10

H-Index

2005

Active since

Affiliations

Institute of High Performance Computing(Current)

Institute of Microelectronics

Infineon Technologies (Singapore)

STMicroelectronics (Singapore)

STATS ChipPAC (Singapore)

V.P. Ganesh is an author at Institute of High Performance Computing specializing in engineering, electronic packaging, and electrical engineering.

Top concepts

EngineeringElectronic PackagingMicroelectronicsElectrical EngineeringMaterial ScienceMechanical Engineering3D PrintingApplied PhysicsMicrofabricationAdvanced Packaging

Publications per year

2005–2011

11

Publications

11

Three-dimensional system-in-package using stacked silicon platform technology

V. Kripesh, Seung Wook Yoon, V.P. Ganesh et al. · IEEE Transactions on Advanced Packaging · 2005 · 76 citations

Engineering, Computer Architecture, Good Dice +16

Next generation eWLB (embedded wafer level BGA) packaging

Yonggang Jin, Xavier Baraton, Seung Wook Yoon et al. · 2010 · 72 citations

Mechanical characterization of next generation eWLB (embedded wafer level BGA) packaging

Seung Wook Yoon, Yaojian Lin, Sharma Gaurav et al. · 2011 · 32 citations

Engineering, Thin Ewlb, Mechanical Engineering +20

Numerical Study of Gold Wire Bonding Process on Cu/Low-k Structures

A.G.K. Viswanath, Xiaowu Zhang, V.P. Ganesh · IEEE Transactions on Advanced Packaging · 2007 · 30 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +16

Reliability Studies of a Through Via Silicon Stacked Module for 3D Microsystem Packaging

Seung Wook Yoon, D. Witarsa, S. Yak et al. · 2006 · 27 citations

Engineering, Microsystem Packaging, Mechanical Engineering +19

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