Concepedia

A.G.K. Viswanath

AV

7

Publications

158

Citations

7

H-Index

2006

Active since

Affiliations

Institute of High Performance Computing(Current)

Institute of Microelectronics

A.G.K. Viswanath is an author at Institute of High Performance Computing specializing in engineering, electronic packaging, and microelectronics.

Top concepts

EngineeringElectronic PackagingMicroelectronicsElectrical Engineering3D PrintingMicrofabricationMechanical EngineeringMaterial ScienceHeat Transfer3D Integration

Publications per year

2006–2008

7

Publications

7

Reliability of a Silicon Stacked Module for 3-D SiP Microsystem

Seung Wook Yoon, SoonThor Lim, A.G.K. Viswanath et al. · IEEE Transactions on Advanced Packaging · 2008 · 34 citations

Flip Chip, 3D Ic Architecture, Electrical Engineering +15

Numerical Study of Gold Wire Bonding Process on Cu/Low-k Structures

A.G.K. Viswanath, Xiaowu Zhang, V.P. Ganesh · IEEE Transactions on Advanced Packaging · 2007 · 30 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +16

Reliability Studies of a Through Via Silicon Stacked Module for 3D Microsystem Packaging

Seung Wook Yoon, D. Witarsa, S. Yak et al. · 2006 · 27 citations

Engineering, Microsystem Packaging, Mechanical Engineering +19

Development of 3-D Stack Package Using Silicon Interposer for High-Power Application

Navas Khan, Seung Wook Yoon, A.G.K. Viswanath et al. · IEEE Transactions on Advanced Packaging · 2008 · 24 citations

Engineering, Computer Architecture, Advanced Packaging (Semiconductors) +17

Numerical Analysis by 3D Finite Element Wire Bond Simulation on Cu/Low-K Structures

A.G.K. Viswanath, Fang Wang, Xiaowu Zhang et al. · 2006 · 17 citations

Numerical Analysis, Engineering, Severe Plastic Deformation +22

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