Poi-Siong Teo

Thermal management of high power dissipation electronic packages: from air cooling to liquid cooling

Hengyun Zhang, D. Pinjala, Poi-Siong Teo · 2004 · 63 citations

Engineering, Electrical Engineering, Materials Engineering +17

Moisture-induced failures of adhesive flip chip interconnects

Lay Kuan Teh, Mary Teo, E. Anto et al. · IEEE Transactions on Components and Packaging Technologies · 2005 · 63 citations

Engineering, Materials Engineering, Materials Science +16

Development and reliability of non-conductive adhesive flip-chip packages

Lay Kuan Teh, E. Anto, Christian Wong et al. · Thin Solid Films · 2004 · 60 citations

Engineering, Electrical Engineering, Materials Engineering +12

Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder

Aditya Kumar, Mingyi He, Zhong Chen et al. · Thin Solid Films · 2004 · 50 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +12

Synthesis and cure kinetics of isotropic conductive adhesives comprising sub-micrometer sized nickel particles

Chin Foo Goh, H.Y. Yu, Shi Yong et al. · Materials Science and Engineering B · 2004 · 38 citations

Natural Sciences, Materials Engineering, Materials Science +14