Concepedia

Mary Teo

MT

3

Publications

98

Citations

3

H-Index

2003

Active since

Affiliations

Nanyang Technological University(Current)

Institute of Microelectronics

Mary Teo is an author at Nanyang Technological University specializing in materials science, electronic packaging, and engineering.

Top concepts

Publications per year

2003–2005

3

Publications

3

Moisture-induced failures of adhesive flip chip interconnects

Lay Kuan Teh, Mary Teo, E. Anto et al. · IEEE Transactions on Components and Packaging Technologies · 2005 · 62 citations

, , +13

Characterization of low‐<i>k</i> benzocyclobutene dielectric thin film

KL Chan, Mary Teo, Zhiming Zhong · Microelectronics International · 2003 · 25 citations

, , +20

Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects]

Mary Teo, Subodh G. Mhaisalkar, E.H. Wong et al. · 2004 · 11 citations

, , +20

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