Lay Kuan Teh

Growth imperfections in three-dimensional colloidal self-assembly

Lay Kuan Teh, Nathanael Tan, Christian Wong et al. · Applied Physics A · 2004 · 70 citations

Materials Science, Pattern Formation, Colloidal Material +7

Moisture-induced failures of adhesive flip chip interconnects

Lay Kuan Teh, Mary Teo, E. Anto et al. · IEEE Transactions on Components and Packaging Technologies · 2005 · 62 citations

Materials Science, Engineering, Advanced Packaging (Semiconductors) +13

Development and reliability of non-conductive adhesive flip-chip packages

Lay Kuan Teh, E. Anto, Christian Wong et al. · Thin Solid Films · 2004 · 60 citations

Electrical Engineering, Chip-scale Package, Engineering +6

Layer Transfer Approach to Opaline Hetero Photonic Crystals

Qingfeng Yan, Lay Kuan Teh, Qi Shao et al. · Langmuir · 2008 · 59 citations

Materials Science, Photonics, Layer Transfer Technique +13

Modeling of the effect of Al2O3 interlayer on residual stress due to oxide scale in thermal barrier coatings

Andi M. Limarga, Sujanto Widjaja, T.H. Yip et al. · Surface and Coatings Technology · 2002 · 53 citations

Materials Engineering, Materials Science, Thermal Spray Coating +8